Publication:

3D Device/package fault isolation and failure analysis

Date

2017
Presentation
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dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2021-10-24T04:01:42Z
dc.date.available2021-10-24T04:01:42Z
dc.date.issued2017
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/28181
dc.source.conference43rd International symposium for testing and failure analysis (ISTFA)
dc.source.conferencedate5/11/2017
dc.source.conferencelocationPasadena, CA USA
dc.title

3D Device/package fault isolation and failure analysis

dc.typeOral presentation
dspace.entity.typePublication
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