Skip to content
Institutional repository
Communities & Collections
Browse
Site
Log In
imec Publications
Conference contributions
Material transport in copper-solder-micro-contacts under electric current
Publication:
Material transport in copper-solder-micro-contacts under electric current
Date
1995
Proceedings Paper
Simple item page
Full metadata
Statistics
Loading...
Loading...
Files
747.pdf
428.31 KB
Basic data
APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Möller, A.
;
Trenkler, Thomas
;
Gehring, T.
;
Meusel, E.
Journal
Abstract
Description
Metrics
Downloads
1
since deposited on 2021-09-29
Acq. date: 2025-10-24
Views
1982
since deposited on 2021-09-29
Acq. date: 2025-10-24
Citations
Metrics
Downloads
1
since deposited on 2021-09-29
Acq. date: 2025-10-24
Views
1982
since deposited on 2021-09-29
Acq. date: 2025-10-24
Citations