Monolithic PIC platforms developed in the PIXEurope pilot line for open access services

Abstract

This paper gives an overview of the monolithic PIC technologies that are to be developed in the PIXEurope pilot line, which is one of the first five Chips JU pilot lines launched in Europe as part of the European Chips Act. The five-year PIXEurope project started in June 2025 and a selection of the first results obtained since then are reported here. However, the main goal of the paper is to provide an introduction to all the different monolithic PIC platforms that are planned to be developed in PIXEurope and to explain their complementarity for different applications, wavelength ranges and end-user needs. In particular, the presentation will introduce PIC platforms based on indium phosphide, 220 nm and 3 μm thick silicon-on-insulator, silicon nitride, aluminum oxide, silicon carbide and germanium. Together these PIC platforms can fulfil the needs for both passive and active PIC components in the wavelength range from UV and visible all the way to mid-infrared. The development of design kits, hybrid integration, packaging and testing for the PICs in PIXEurope is also briefly summarized.