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BTI reliability improvement strategies in low thermal budget gate dtacks for 3D sequential integration
Publication:
BTI reliability improvement strategies in low thermal budget gate dtacks for 3D sequential integration
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Date
2018-12
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Franco, Jacopo
;
Wu, Zhicheng
;
Rzepa, Gerhard
;
Vandooren, Anne
;
Arimura, Hiroaki
;
Ragnarsson, Lars-Ake
;
Hellings, Geert
;
Brus, Stephan
;
Cott, Daire
;
De Heyn, Vincent
;
Groeseneken, Guido
;
Horiguchi, Naoto
;
Ryckaert, Julien
;
Collaert, Nadine
;
Linten, Dimitri
;
Grasser, Tibor
;
Kaczer, Ben
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1987
since deposited on 2021-10-25
1
last month
Acq. date: 2025-12-10
Citations
Metrics
Views
1987
since deposited on 2021-10-25
1
last month
Acq. date: 2025-12-10
Citations