Effects of oxygen and fluorine on the dry etch characteristics of organic low-k dielectrics

dc.contributor.author	Baklanov, Mikhaïl
dc.contributor.author	Vanhaelemeersch, Serge
dc.contributor.author	Bender, Hugo
dc.contributor.author	Maex, Karen
dc.contributor.imecauthor	Vanhaelemeersch, Serge
dc.contributor.imecauthor	Bender, Hugo
dc.contributor.imecauthor	Maex, Karen
dc.contributor.orcidimec	Vanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned	2021-10-06T10:41:39Z
dc.date.available	2021-10-06T10:41:39Z
dc.date.issued	1999
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/3210
dc.source.beginpage	372
dc.source.endpage	379
dc.source.issue	2
dc.source.journal	J. Vacuum Science and Technology B
dc.source.volume	17
dc.title	Effects of oxygen and fluorine on the dry etch characteristics of organic low-k dielectrics
dc.type	Journal article
dspace.entity.type	Publication
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