Publication:
Technology benchmarking of copper electromigration using a grain-sensitive simulation framework
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-2663-1922 | |
| cris.virtual.orcid | 0000-0002-3955-0638 | |
| cris.virtual.orcid | 0000-0003-3822-5953 | |
| cris.virtual.orcid | 0000-0002-0290-691X | |
| cris.virtualsource.department | e31fa604-dc86-4079-912d-679d8185648f | |
| cris.virtualsource.department | e5db7419-6810-435c-9c41-67ff0eeb4bc3 | |
| cris.virtualsource.department | 99f46578-0b77-4a3f-b8e5-a6879cd2ea9a | |
| cris.virtualsource.department | 60497238-bd25-43d2-a0aa-de0269427c92 | |
| cris.virtualsource.orcid | e31fa604-dc86-4079-912d-679d8185648f | |
| cris.virtualsource.orcid | e5db7419-6810-435c-9c41-67ff0eeb4bc3 | |
| cris.virtualsource.orcid | 99f46578-0b77-4a3f-b8e5-a6879cd2ea9a | |
| cris.virtualsource.orcid | 60497238-bd25-43d2-a0aa-de0269427c92 | |
| dc.contributor.author | Saleh, Ahmed | |
| dc.contributor.author | Croes, Kristof | |
| dc.contributor.author | Ceric, H. | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Zahedmanesh, Houman | |
| dc.contributor.imecauthor | Saleh, A. S. | |
| dc.contributor.imecauthor | Croes, K. | |
| dc.contributor.imecauthor | De Wolf, I | |
| dc.contributor.imecauthor | Zahedmanesh, H. | |
| dc.date.accessioned | 2025-03-06T20:45:29Z | |
| dc.date.available | 2025-03-06T20:45:29Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/IITC61274.2024.10732543 | |
| dc.identifier.eisbn | 979-8-3503-8517-5 | |
| dc.identifier.isbn | 979-8-3503-8518-2 | |
| dc.identifier.issn | 2380-632X | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45318 | |
| dc.publisher | IEEE | |
| dc.source.conference | 2024 International Interconnect Technology Conference | |
| dc.source.conferencedate | 2024-06-03 | |
| dc.source.conferencelocation | San Jose | |
| dc.source.numberofpages | 3 | |
| dc.title | Technology benchmarking of copper electromigration using a grain-sensitive simulation framework | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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