Publication:
Technology benchmarking of copper electromigration using a grain-sensitive simulation framework
| dc.contributor.author | Saleh, Ahmed | |
| dc.contributor.author | Croes, Kristof | |
| dc.contributor.author | Ceric, H. | |
| dc.contributor.author | De Wolf, Ingrid | |
| dc.contributor.author | Zahedmanesh, Houman | |
| dc.contributor.imecauthor | Saleh, A. S. | |
| dc.contributor.imecauthor | Croes, K. | |
| dc.contributor.imecauthor | De Wolf, I | |
| dc.contributor.imecauthor | Zahedmanesh, H. | |
| dc.date.accessioned | 2025-03-06T20:45:29Z | |
| dc.date.available | 2025-03-06T20:45:29Z | |
| dc.date.issued | 2024 | |
| dc.identifier.doi | 10.1109/IITC61274.2024.10732543 | |
| dc.identifier.eisbn | 979-8-3503-8517-5 | |
| dc.identifier.isbn | 979-8-3503-8518-2 | |
| dc.identifier.issn | 2380-632X | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/45318 | |
| dc.publisher | IEEE | |
| dc.source.conference | 2024 International Interconnect Technology Conference | |
| dc.source.conferencedate | 2024-06-03 | |
| dc.source.conferencelocation | San Jose | |
| dc.source.numberofpages | 3 | |
| dc.title | Technology benchmarking of copper electromigration using a grain-sensitive simulation framework | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
| Publication available in collections: |