Publication:
Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package
Date
| dc.contributor.author | Limaye, Paresh | |
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Van de Peer, Joost | |
| dc.contributor.author | Donders, S. | |
| dc.contributor.author | Darveaux, Robert | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-16T02:56:41Z | |
| dc.date.available | 2021-10-16T02:56:41Z | |
| dc.date.issued | 2005-04 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/10785 | |
| dc.source.beginpage | 531 | |
| dc.source.conference | Proceedings of the 6th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics | |
| dc.source.conferencedate | 17/04/2005 | |
| dc.source.conferencelocation | Berlin Belgium | |
| dc.source.endpage | 537 | |
| dc.title | Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
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