Publication:

Challenges in the packaging of GaN-on-si devices

Date

2011-03
Journal article
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dc.contributor.authorLa Manna, Antonio
dc.contributor.authorLimaye, Paresh
dc.contributor.authorDecoutere, Stefaan
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorDecoutere, Stefaan
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDecoutere, Stefaan::0000-0001-6632-6239
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T15:06:49Z
dc.date.available2021-10-19T15:06:49Z
dc.date.issued2011-03
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/19225
dc.identifier.urlhttp://www.semiconductorpackagingnews.com/articles/article_29571.shtml
dc.source.journalSemiconductor Packaging News
dc.title

Challenges in the packaging of GaN-on-si devices

dc.typeJournal article
dspace.entity.typePublication
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