Publication:

Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bonding

Date

2020

Proceedings Paper

https://doi.org/10.1109/ECTC32862.2020.00046

Simple item page Full metadata Statistics

Author(s)

;

;

;

;

;

;

;

Journal

na

Statistics

1833 since deposited on 2021-11-02

1last month

Acq. date: 2026-04-25