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Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bonding
Publication:
Novel Cu/SiCN surface topography control for 1 mu m pitch hybrid wafer-to-wafer bonding
Date
2020
Proceedings Paper
https://doi.org/10.1109/ECTC32862.2020.00046
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kim, Soon-Wook
;
Fodor, Ferenc
;
Heylen, Nancy
;
Iacovo, Serena
;
De Vos, Joeri
;
Miller, Andy
;
Beyer, Gerald
;
Beyne, Eric
Journal
na
Abstract
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1827
since deposited on 2021-11-02
Acq. date: 2025-10-27
Citations
Metrics
Views
1827
since deposited on 2021-11-02
Acq. date: 2025-10-27
Citations