Publication:

Underfill material screening and process characterization for 3D stacking

Date

2012
Proceedings Paper
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dc.contributor.authorRebibis, Kenneth June
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorGerets, Carine
dc.contributor.authorBeyne, Eric
dc.contributor.authorDaily, Robert
dc.contributor.authorCapuz, Giovanni
dc.contributor.imecauthorRebibis, Kenneth June
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorGerets, Carine
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorCapuz, Giovanni
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecCapuz, Giovanni::0000-0002-5263-4836
dc.date.accessioned2021-10-20T15:11:00Z
dc.date.available2021-10-20T15:11:00Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21387
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6542099&queryText%3DUnderfill+material+screening+and+process+char
dc.source.conference4th Electronics System Integration Technologies Conference - ESTC
dc.source.conferencedate17/09/2012
dc.source.conferencelocationAmsterdam The Netherlands
dc.title

Underfill material screening and process characterization for 3D stacking

dc.typeProceedings paper
dspace.entity.typePublication
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