Publication:

Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging

Date

2011
Proceedings Paper
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dc.contributor.authorBuisson, Thibault
dc.contributor.authorPotoms, Goedele
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorJaenen, Patrick
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorTravaly, Youssef
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorPotoms, Goedele
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-19T12:40:56Z
dc.date.available2021-10-19T12:40:56Z
dc.date.issued2011
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18630
dc.source.conference13th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate7/12/2011
dc.source.conferencelocationSingapore
dc.title

Integration challenges of Cu pillars with extreme wafer thinning for 3D stacking and packaging

dc.typeProceedings paper
dspace.entity.typePublication
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