Publication:

3D system integration challenges and opportunities

Date

2008
Proceedings Paper
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dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-17T06:17:40Z
dc.date.available2021-10-17T06:17:40Z
dc.date.issued2008
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13381
dc.source.conferenceIEEE Systems Packaging Japan Workshop "The Technology Vision of Electronics Packaging for the 2010's"
dc.source.conferencedate28/01/2008
dc.source.conferencelocationHakone Japan
dc.title

3D system integration challenges and opportunities

dc.typeProceedings paper
dspace.entity.typePublication
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