Publication:

Modification of post-etch residues by UV for wet removal

Date

2010
Meeting abstract
Simple item page Full metadata Statistics
 
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorDrieskens, Frederik
dc.contributor.authorde Marneffe, Jean-Francois
dc.contributor.authorConard, Thierry
dc.contributor.authorLux, Marcel
dc.contributor.authorStruyf, Herbert
dc.contributor.authorVereecke, Guy
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorde Marneffe, Jean-Francois
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorLux, Marcel
dc.contributor.imecauthorStruyf, Herbert
dc.contributor.imecauthorVereecke, Guy
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.contributor.orcidimecVereecke, Guy::0000-0001-9058-9338
dc.date.accessioned2021-10-18T18:07:51Z
dc.date.available2021-10-18T18:07:51Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17463
dc.source.beginpage50
dc.source.conference10th International Symposium on Ultra-Clean Processing of Semiconductor Devices - UCPSS
dc.source.conferencedate19/09/2010
dc.source.conferencelocationOostende Belgium
dc.source.endpage51
dc.title

Modification of post-etch residues by UV for wet removal

dc.typeMeeting abstract
dspace.entity.typePublication
Files

Original bundle

Name:
21324.pdf
Size:
299.87 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions