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On the cost-effectiveness of matching repositories of pre-tested wafers for wafer-to-wafer 3D chip stacking
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On the cost-effectiveness of matching repositories of pre-tested wafers for wafer-to-wafer 3D chip stacking
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Date
2010
Proceedings Paper
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20376.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Verbree, Jouke
;
Marinissen, Erik Jan
;
Roussel, Philippe
;
Velenis, Dimitrios
Journal
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1979
since deposited on 2021-10-18
Acq. date: 2025-12-14
Citations
Metrics
Views
1979
since deposited on 2021-10-18
Acq. date: 2025-12-14
Citations