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ESD protection design in active interposer for 2.5 and 3D systems-in-package
Publication:
ESD protection design in active interposer for 2.5 and 3D systems-in-package
Date
2015-09
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Scholz, Mirko
;
Hellings, Geert
;
Chen, Shih-Hung
;
Linten, Dimitri
;
Detalle, Mikael
;
Roda Neve, Cesar
;
Shibkov, Andrei
;
La Manna, Antonio
;
Van der Plas, Geert
;
Beyne, Eric
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1926
since deposited on 2021-10-22
410
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Acq. date: 2025-10-24
Citations
Metrics
Views
1926
since deposited on 2021-10-22
410
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations