Publication:

High density 3-D stack structure for SIP solutions

Date

2003
Proceedings Paper
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dc.contributor.authorStoukatch, Serguei
dc.contributor.authorHo, Meng
dc.contributor.authorVaesen, Kristof
dc.contributor.authorWebers, Tomas
dc.contributor.authorCarchon, Geert
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorDe Baets, Johan
dc.contributor.authorNaem, Abdalla
dc.contributor.authorPoddar, Anindya
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorWebers, Tomas
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.imecauthorDe Baets, Johan
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-15T06:52:11Z
dc.date.available2021-10-15T06:52:11Z
dc.date.issued2003
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/8190
dc.source.beginpage341
dc.source.conference14th European Microelectronics and Packaging Conference & Exhibition - EMPC
dc.source.conferencedate23/02/2003
dc.source.conferencelocationFriedrichshafen Germany
dc.source.endpage343
dc.title

High density 3-D stack structure for SIP solutions

dc.typeProceedings paper
dspace.entity.typePublication
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