Publication:

Controlled cobalt recess for advanced interconnect metallization

Date

2019
Proceedings Paper
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dc.contributor.authorPacco, Antoine
dc.contributor.authorAkanishi, Yuya
dc.contributor.authorMurdoch, Gayle
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorHolsteyns, Frank
dc.contributor.imecauthorPacco, Antoine
dc.contributor.imecauthorAkanishi, Yuya
dc.contributor.imecauthorMurdoch, Gayle
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-27T15:15:56Z
dc.date.available2021-10-27T15:15:56Z
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33718
dc.source.conferenceSPCC: The Surface Preparation and Cleaning Conference
dc.source.conferencedate1/04/2019
dc.source.conferencelocationPortland, OR USA
dc.title

Controlled cobalt recess for advanced interconnect metallization

dc.typeProceedings paper
dspace.entity.typePublication
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