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Cleaning and etching solutions for the prospective use of Molybdenum in next generation interconnect fabrication.

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dc.contributor.authorPacco, Antoine
dc.contributor.authorLe, Quoc Toan
dc.contributor.authorAkanishi, Yuya
dc.contributor.authorAltamirano Sanchez, Efrain
dc.contributor.imecauthorPacco, Antoine
dc.contributor.imecauthorLe, Quoc Toan
dc.contributor.imecauthorAkanishi, Yuya
dc.contributor.imecauthorAltamirano Sanchez, Efrain
dc.contributor.orcidimecLe, Quoc Toan::0000-0002-0206-6279
dc.date.accessioned2021-10-29T01:45:48Z
dc.date.available2021-10-29T01:45:48Z
dc.date.issued2020
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/35695
dc.identifier.urlhttps://www.web-events.net/doc/users/840/bib/globalprogramvf.pdf
dc.source.beginpageS8.3
dc.source.conference29th Materials for Advanced Metallization (MAM) Conference
dc.source.conferencedate22/03/2020
dc.source.conferencelocationOnline Online
dc.title

Cleaning and etching solutions for the prospective use of Molybdenum in next generation interconnect fabrication.

dc.typeMeeting abstract
dspace.entity.typePublication
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