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CVD Mn-based self-formed barrier for advanced interconnect technology

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dc.contributor.authorSiew, Yong Kong
dc.contributor.authorJourdan, Nicolas
dc.contributor.authorBarbarin, Yohan
dc.contributor.authorMachillot, Jerome
dc.contributor.authorDemuynck, Steven
dc.contributor.authorCroes, Kristof
dc.contributor.authorTseng, J.
dc.contributor.authorAi, Hua
dc.contributor.authorTang, Jing
dc.contributor.authorNaik, M.
dc.contributor.authorWang, P.
dc.contributor.authorNarasimhan, M.
dc.contributor.authorAbraham, M.
dc.contributor.authorCockburn, Andrew
dc.contributor.authorBoemmels, Juergen
dc.contributor.authorTokei, Zsolt
dc.contributor.imecauthorSiew, Yong Kong
dc.contributor.imecauthorJourdan, Nicolas
dc.contributor.imecauthorMachillot, Jerome
dc.contributor.imecauthorDemuynck, Steven
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorCockburn, Andrew
dc.contributor.imecauthorBoemmels, Juergen
dc.contributor.imecauthorTokei, Zsolt
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-21T12:02:31Z
dc.date.available2021-10-21T12:02:31Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/23080
dc.identifier.urlhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6615551&contentType=Conference+Publications
dc.source.beginpage2.3
dc.source.conferenceIEEE International Interconnect Technology Conference - IITC
dc.source.conferencedate13/06/2013
dc.source.conferencelocationKyoto Japan
dc.title

CVD Mn-based self-formed barrier for advanced interconnect technology

dc.typeProceedings paper
dspace.entity.typePublication
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