Publication:

Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

Date

2012
Journal article
Simple item page Full metadata Statistics
 
dc.contributor.authorWang, Liang
dc.contributor.authorSterken, Tom
dc.contributor.authorCauwe, Maarten
dc.contributor.authorCuypers, Dieter
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorSterken, Tom
dc.contributor.imecauthorCauwe, Maarten
dc.contributor.imecauthorCuypers, Dieter
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecCauwe, Maarten::0000-0002-6413-998X
dc.contributor.orcidimecCuypers, Dieter::0000-0003-0550-6273
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-20T18:48:25Z
dc.date.available2021-10-20T18:48:25Z
dc.date.embargo9999-12-31
dc.date.issued2012
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/21830
dc.source.beginpage1099
dc.source.endpage1106
dc.source.issue7
dc.source.journalIEEE Transactions on Components, Packaging and Manufacturing Technology
dc.source.volume2
dc.title

Fabrication and characterization of flexible ultrathin chip package using photosensitive polyimide

dc.typeJournal article
dspace.entity.typePublication
Files

Original bundle

Name:
25307.pdf
Size:
1.23 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Articles