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CMP on SiGe materials – linking chemical and physical properties to design low defect and selective slurries

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dc.contributor.authorOng, Patrick
dc.contributor.authorSiebert, Max
dc.contributor.authorLeunissen, Leonardus H. A.
dc.contributor.authorIbrahim, Sheikh Ansar Usman
dc.contributor.authorTeugels, Lieve
dc.contributor.imecauthorOng, Patrick
dc.contributor.imecauthorTeugels, Lieve
dc.contributor.orcidimecOng, Patrick::0000-0002-2072-292X
dc.contributor.orcidimecTeugels, Lieve::0000-0002-6613-9414
dc.date.accessioned2021-10-22T04:27:24Z
dc.date.available2021-10-22T04:27:24Z
dc.date.issued2014
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/24345
dc.source.conferenceInternational Conference on Planarization Technology - ICPT
dc.source.conferencedate19/11/2014
dc.source.conferencelocationKobe Japan
dc.title

CMP on SiGe materials – linking chemical and physical properties to design low defect and selective slurries

dc.typeProceedings paper
dspace.entity.typePublication
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