Publication:
An analytic method to compute the stress dependence on the dimensions and its influence in the characteristics of triple gate devices
Date
| dc.contributor.author | Trevisoli, R.D. | |
| dc.contributor.author | Martino, J.A. | |
| dc.contributor.author | Simoen, Eddy | |
| dc.contributor.author | Claeys, Cor | |
| dc.contributor.author | Pavanello, M.A. | |
| dc.contributor.imecauthor | Simoen, Eddy | |
| dc.contributor.orcidimec | Simoen, Eddy::0000-0002-5218-4046 | |
| dc.date.accessioned | 2021-10-20T17:08:29Z | |
| dc.date.available | 2021-10-20T17:08:29Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 2012 | |
| dc.identifier.issn | 0026-2714 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/21634 | |
| dc.source.beginpage | 519 | |
| dc.source.endpage | 524 | |
| dc.source.issue | 3 | |
| dc.source.journal | Microelectronics Reliability | |
| dc.source.volume | 52 | |
| dc.title | An analytic method to compute the stress dependence on the dimensions and its influence in the characteristics of triple gate devices | |
| dc.type | Journal article | |
| dspace.entity.type | Publication | |
| Files | Original bundle
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