Publication:

Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations

Date

2023
Proceedings Paper
https://doi.org/10.1109/IITC/MAM57687.2023.10154717
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dc.contributor.authorTierno, Davide
dc.contributor.authorCiofi, Ivan
dc.contributor.authorParvais, Bertrand
dc.contributor.authorCroes, Kristof
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.imecauthorTierno, Davide
dc.contributor.imecauthorCiofi, Ivan
dc.contributor.imecauthorParvais, Bertrand
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.orcidimecTierno, Davide::0000-0003-4915-904X
dc.contributor.orcidimecCiofi, Ivan::0000-0003-1374-4116
dc.contributor.orcidimecParvais, Bertrand::0000-0003-0769-7069
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.date.accessioned2023-08-09T12:36:58Z
dc.date.available2023-08-07T17:07:26Z
dc.date.available2023-08-08T13:28:38Z
dc.date.available2023-08-09T12:36:58Z
dc.date.embargo9999-12-31
dc.date.issued2023
dc.identifier.doi10.1109/IITC/MAM57687.2023.10154717
dc.identifier.eisbn979-8-3503-1097-9
dc.identifier.issn2380-632X
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42295
dc.publisherIEEE
dc.source.conferenceIEEE International Interconnect Technology Conference (IITC) / IEEE Materials for Advanced Metallization Conference (MAM)
dc.source.conferencedateMAY 22-25, 2023
dc.source.conferencelocationDresden
dc.source.journalIEEE International Conference on Interconnect Technology
dc.source.numberofpages3
dc.subject.keywordsRESISTANCE
dc.subject.keywordsRESISTIVITY
dc.title

Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations

dc.typeProceedings paper
dspace.entity.typePublication
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