Publication:

3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias

Date

2011

Journal article

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Files

21094.pdf 1.19 MB

Author(s)

;

Sabuncuoglu Tezcan, Deniz

;

Philipsen, Harold

;

;

Jaenen, Patrick

;

Travaly, Youssef

;

Soussan, Philippe

;

;

Journal

IEEE Transactions on Components, Packaging and Manufacturing Technology

Statistics

1998 since deposited on 2021-10-19

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Acq. date: 2026-08-08