Publication:
3D wafer-level packaging die stacking using spin-on-dielectric polymer liner through-silicon vias
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1993 since deposited on 2021-10-19
3last month
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Acq. date: 2025-12-08
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1993 since deposited on 2021-10-19
3last month
2last week
Acq. date: 2025-12-08
Citations