Publication:

Reduction of surface metallic contamination through optimized rinsing and single-wafer drying

Date

2002
Proceedings Paper
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dc.contributor.authorFyen, Wim
dc.contributor.authorHolsteyns, Frank
dc.contributor.authorLauerhaas, Jeff
dc.contributor.authorBearda, Twan
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorHolsteyns, Frank
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.date.accessioned2021-10-14T21:39:53Z
dc.date.available2021-10-14T21:39:53Z
dc.date.embargo9999-12-31
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6340
dc.source.beginpage91
dc.source.conferenceCleaning Technology in Semiconductor Device Manufacturing VII
dc.source.conferencedate4/09/2001
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage101
dc.title

Reduction of surface metallic contamination through optimized rinsing and single-wafer drying

dc.typeProceedings paper
dspace.entity.typePublication
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