Publication:

200mm Reconstituted Wafer for Fan-out of Microfluidics and CMOS Electronics

Date

2024
Proceedings Paper
https://doi.org/10.1109/eptc62800.2024.10909847
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dc.contributor.authorWei, Wei
dc.contributor.authorZhang, Lei
dc.contributor.authorTobback, Bert
dc.contributor.authorVisker, Jakob
dc.contributor.authorMalainou, Antonia
dc.contributor.authorStakenborg, Tim
dc.contributor.authorKarve, Gauri
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.date.accessioned2026-05-28T07:17:02Z
dc.date.available2026-05-28T07:17:02Z
dc.date.createdwos2026-02-10
dc.date.issued2024
dc.description.abstractWafer reconstruction uses an embedded die method by putting separated chips from different sources on a shared silicon carrier [1]–[4]. This platform enables further processing on landing wafer as a regular 200mm substrate, which provides solution to fan-out both electronics and microfluidics. This paper describes the complete process on reconstructed wafer where we accomplish the combination of active chips and microfluidics structures. This work demonstrates the potential of wafer reconstruction as an integration process platform for life science applications.
dc.description.wosFundingTextThis work is part of the Moore4Medical project funded by the ECSEL Joint Undertaking under the grant number H2020-EXCEL-2019-IA-876190. Authors also thank for imec engineers Geert Langenus, Geert Schoofs for population process, Glen Maes and Hans Dusar for non-standard SiO2 thickness measurement, Riet Labie for Glass bonding test.
dc.identifier.doi10.1109/eptc62800.2024.10909847
dc.identifier.isbn979-8-3315-2201-8
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59449
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.beginpage458
dc.source.conferenceIEEE 26th Electronics Packaging Technology Conference (EPTC)
dc.source.conferencedate2024-12-03
dc.source.conferencelocationSingapore
dc.source.endpage461
dc.source.journal2024 IEEE 26TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, EPTC
dc.source.numberofpages4
dc.title

200mm Reconstituted Wafer for Fan-out of Microfluidics and CMOS Electronics

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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