Publication:
Metallization approaches and challenges for interconnect downscaling both from R and C perspective
Date
| dc.contributor.author | Armini, Silvia | |
| dc.contributor.imecauthor | Armini, Silvia | |
| dc.contributor.orcidimec | Armini, Silvia::0000-0003-0578-3422 | |
| dc.date.accessioned | 2021-10-22T18:30:36Z | |
| dc.date.available | 2021-10-22T18:30:36Z | |
| dc.date.issued | 2015 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/24941 | |
| dc.source.conference | CSTIC Symposium IV: Thin Film Technology | |
| dc.source.conferencedate | 15/03/2015 | |
| dc.source.conferencelocation | Shanghai China | |
| dc.title | Metallization approaches and challenges for interconnect downscaling both from R and C perspective | |
| dc.type | Meeting abstract | |
| dspace.entity.type | Publication | |
| Files | ||
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