Publication:
Flip chip based packaging solution for high current driver chips used in automotive applications
Date
| dc.contributor.author | Vandevelde, Bart | |
| dc.contributor.author | Vandecasteele, Bjorn | |
| dc.contributor.author | Vanderstraeten, Daniel | |
| dc.contributor.author | Brizar, Guy | |
| dc.contributor.author | Blansaer, Eddy | |
| dc.contributor.imecauthor | Vandevelde, Bart | |
| dc.contributor.imecauthor | Vandecasteele, Bjorn | |
| dc.contributor.orcidimec | Vandevelde, Bart::0000-0002-6753-6438 | |
| dc.date.accessioned | 2021-10-17T12:15:48Z | |
| dc.date.available | 2021-10-17T12:15:48Z | |
| dc.date.issued | 2008 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/14712 | |
| dc.source.beginpage | 583 | |
| dc.source.conference | 2nd Electronics Systemintegration Technology Conference - ESTC | |
| dc.source.conferencedate | 1/09/2008 | |
| dc.source.conferencelocation | Greenwich UK | |
| dc.source.endpage | 588 | |
| dc.title | Flip chip based packaging solution for high current driver chips used in automotive applications | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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