Publication:

Do we have to worry about extended defects in high-mobility materials?

Date

2018
Proceedings Paper
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dc.contributor.authorSimoen, Eddy
dc.contributor.authorHsu, Brent
dc.contributor.authorHe, Liang
dc.contributor.authorMols, Yves
dc.contributor.authorKunert, Bernardette
dc.contributor.authorLanger, Robert
dc.contributor.authorWaldron, Niamh
dc.contributor.authorEneman, Geert
dc.contributor.authorCollaert, Nadine
dc.contributor.authorHeyns, Marc
dc.contributor.authorClaeys, Cor
dc.contributor.imecauthorSimoen, Eddy
dc.contributor.imecauthorHsu, Brent
dc.contributor.imecauthorMols, Yves
dc.contributor.imecauthorKunert, Bernardette
dc.contributor.imecauthorLanger, Robert
dc.contributor.imecauthorWaldron, Niamh
dc.contributor.imecauthorEneman, Geert
dc.contributor.imecauthorCollaert, Nadine
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecSimoen, Eddy::0000-0002-5218-4046
dc.contributor.orcidimecHsu, Brent::0000-0003-0823-6088
dc.contributor.orcidimecKunert, Bernardette::0000-0002-8986-4109
dc.contributor.orcidimecLanger, Robert::0000-0002-1132-3468
dc.contributor.orcidimecEneman, Geert::0000-0002-5849-3384
dc.contributor.orcidimecCollaert, Nadine::0000-0002-8062-3165
dc.date.accessioned2021-10-26T03:56:06Z
dc.date.available2021-10-26T03:56:06Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/31786
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8369190/?tp=&arnumber=8369190
dc.source.conferenceChina Semiconductor Technology International Conference - CSTIC
dc.source.conferencedate11/03/2018
dc.source.conferencelocationShanghai China
dc.title

Do we have to worry about extended defects in high-mobility materials?

dc.typeProceedings paper
dspace.entity.typePublication
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