Publication:

On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes

Date

2015
Proceedings Paper
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dc.contributor.authorCavaco, Celso
dc.contributor.authorPeng, Lan
dc.contributor.authorSebaai, Farid
dc.contributor.authorVerbinnen, Greet
dc.contributor.authorVisker, Jakob
dc.contributor.authorVan Olmen, Jan
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorOsman, Haris
dc.contributor.imecauthorCavaco, Celso
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorSebaai, Farid
dc.contributor.imecauthorVerbinnen, Greet
dc.contributor.imecauthorVisker, Jakob
dc.contributor.imecauthorVan Olmen, Jan
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorOsman, Haris
dc.contributor.orcidimecCavaco, Celso::0000-0001-9079-338X
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.date.accessioned2021-10-22T18:37:14Z
dc.date.available2021-10-22T18:37:14Z
dc.date.issued2015
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/25037
dc.identifier.urlhttp://ecst.ecsdl.org/content/64/40/123.abstract
dc.source.beginpage123
dc.source.conferenceProcessing Materials of 3D Interconnects, Damascene, and Electronics Packaging 6
dc.source.conferencedate5/10/2014
dc.source.conferencelocationCancun Mexico
dc.source.endpage129
dc.title

On the fabrication of backside illuminated image sensors: bonding oxide, edge trimming and CMP rework routes

dc.typeProceedings paper
dspace.entity.typePublication
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