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III-V/Si PICs based on micro-transfer-printing

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dc.contributor.authorRoelkens, Gunther
dc.contributor.authorZhang, Jing
dc.contributor.authorMuliuk, Grigorij
dc.contributor.authorGoyvaerts, Jeroen
dc.contributor.authorHaq, Bahawal
dc.contributor.authorOp de Beeck, Camiel
dc.contributor.authorLiles, Alex
dc.contributor.authorWang, Zheng
dc.contributor.authorDhoore, Soren
dc.contributor.authorKumari, Sulakshna
dc.contributor.authorJuvert Sandez, Joan
dc.contributor.authorVan Campenhout, Joris
dc.contributor.authorKuyken, Bart
dc.contributor.authorVan Thourhout, Dries
dc.contributor.authorCorbett, Brian
dc.contributor.authorTrindade, Antonio Jose
dc.contributor.authorBower, Chris
dc.contributor.authorBaets, Roel
dc.contributor.imecauthorRoelkens, Gunther
dc.contributor.imecauthorZhang, Jing
dc.contributor.imecauthorMuliuk, Grigorij
dc.contributor.imecauthorGoyvaerts, Jeroen
dc.contributor.imecauthorHaq, Bahawal
dc.contributor.imecauthorOp de Beeck, Camiel
dc.contributor.imecauthorLiles, Alex
dc.contributor.imecauthorWang, Zheng
dc.contributor.imecauthorDhoore, Soren
dc.contributor.imecauthorKumari, Sulakshna
dc.contributor.imecauthorVan Campenhout, Joris
dc.contributor.imecauthorKuyken, Bart
dc.contributor.imecauthorVan Thourhout, Dries
dc.contributor.imecauthorBaets, Roel
dc.contributor.orcidimecRoelkens, Gunther::0000-0002-4667-5092
dc.contributor.orcidimecZhang, Jing::0000-0001-6608-9990
dc.contributor.orcidimecWang, Zheng::0000-0002-2143-3847
dc.contributor.orcidimecVan Campenhout, Joris::0000-0003-0778-2669
dc.contributor.orcidimecVan Thourhout, Dries::0000-0003-0111-431X
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.date.accessioned2021-10-27T17:10:18Z
dc.date.available2021-10-27T17:10:18Z
dc.date.embargo9999-12-31
dc.date.issued2019
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/33899
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8696902
dc.source.beginpagepaper W4E.6
dc.source.conferenceOptical Fiber Communications Conference and Exhibition (OFC 2019)
dc.source.conferencedate3/03/2019
dc.source.conferencelocationSan Diego, CA USA
dc.title

III-V/Si PICs based on micro-transfer-printing

dc.typeProceedings paper
dspace.entity.typePublication
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