Publication:

Chip package co-design of a 5GHz RF front-end for WLAN

Date

2000
Proceedings Paper
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dc.contributor.authorWambacq, Piet
dc.contributor.authorDonnay, Stephane
dc.contributor.authorPieters, Philip
dc.contributor.authorDiels, Wim
dc.contributor.authorVaesen, Kristof
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorEngels, Marc
dc.contributor.authorBolsens, Ivo
dc.contributor.imecauthorWambacq, Piet
dc.contributor.imecauthorDonnay, Stephane
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecWambacq, Piet::0000-0003-4388-7257
dc.contributor.orcidimecDonnay, Stephane::0000-0003-2489-4793
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T14:17:14Z
dc.date.available2021-10-14T14:17:14Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4930
dc.source.beginpage318
dc.source.conferenceIEEE International Solid-State Circuits Conference - ISSCC
dc.source.conferencedate7/02/2000
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage319
dc.title

Chip package co-design of a 5GHz RF front-end for WLAN

dc.typeProceedings paper
dspace.entity.typePublication
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