Publication:
Thermal Aspects of Silicon Photonic Interposer Packages
Date
| dc.contributor.author | Oprins, Herman | |
| dc.contributor.author | Ban, Yoojin | |
| dc.contributor.author | Cherman, Vladimir | |
| dc.contributor.author | Van Campenhout, Joris | |
| dc.contributor.imecauthor | Oprins, Herman | |
| dc.contributor.imecauthor | Ban, Yoojin | |
| dc.contributor.imecauthor | Cherman, Vladimir | |
| dc.contributor.imecauthor | Van Campenhout, Joris | |
| dc.contributor.orcidimec | Oprins, Herman::0000-0003-0680-4969 | |
| dc.contributor.orcidimec | Van Campenhout, Joris::0000-0003-0778-2669 | |
| dc.date.accessioned | 2022-01-27T11:25:31Z | |
| dc.date.available | 2021-11-02T16:04:52Z | |
| dc.date.available | 2022-01-27T11:24:10Z | |
| dc.date.available | 2022-01-27T11:25:31Z | |
| dc.date.issued | 2020 | |
| dc.identifier.eisbn | 978-1-7281-6049-8 | |
| dc.identifier.issn | na | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/38166 | |
| dc.publisher | IEEE | |
| dc.source.conference | 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) | |
| dc.source.conferencedate | JUL 05-08, 2020 | |
| dc.source.conferencelocation | Cracow | |
| dc.source.journal | na | |
| dc.source.numberofpages | 6 | |
| dc.title | Thermal Aspects of Silicon Photonic Interposer Packages | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | ||
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