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Integration techniques and applications of thin chips on low cost foil substrates
Publication:
Integration techniques and applications of thin chips on low cost foil substrates
Date
2013
Proceedings Paper
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28119.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
van den Ende, Daan
;
Sridhar, Ashok
;
van den Brand, Jeroen
;
Cauwe, Maarten
;
Vandecasteele, Bjorn
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1934
since deposited on 2021-10-21
Acq. date: 2025-10-28
Citations
Metrics
Views
1934
since deposited on 2021-10-21
Acq. date: 2025-10-28
Citations