Publication:

Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy

Date

2018
Journal article
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dc.contributor.authorJacobs, Kristof J.P.
dc.contributor.authorStucchi, Michele
dc.contributor.authorAfanasiev, Valeri
dc.contributor.authorGonzalez, Mario
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorJacobs, Kristof J.P.
dc.contributor.imecauthorStucchi, Michele
dc.contributor.imecauthorAfanasiev, Valeri
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecJacobs, Kristof J.P.::0000-0002-1081-3633
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-25T20:13:34Z
dc.date.available2021-10-25T20:13:34Z
dc.date.issued2018
dc.identifier.issn0003-6951
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30946
dc.identifier.urlhttps://aip.scitation.org/doi/full/10.1063/1.5012892
dc.source.beginpage71904
dc.source.issue7
dc.source.journalApplied Physics Letters
dc.source.volume112
dc.title

Defect localization of metal interconnection lines in 3-dimensional through-silicon-via structures by differential scanning photocapacitance microscopy

dc.typeJournal article
dspace.entity.typePublication
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