Publication:
Antenna-in-package solution for millimeter-wave applications implemented in a microwave-compatible multilayer PCB technology
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-7117-7976 | |
| cris.virtualsource.department | 570798dc-0f52-4ffe-ac23-218bd5da3a82 | |
| cris.virtualsource.orcid | 570798dc-0f52-4ffe-ac23-218bd5da3a82 | |
| dc.contributor.author | Enayati, Amin | |
| dc.contributor.author | De Raedt, Walter | |
| dc.contributor.author | Vandenbosch, Guy A. E. | |
| dc.contributor.author | Räisänen, Antti V. | |
| dc.date.accessioned | 2026-07-09T09:24:24Z | |
| dc.date.available | 2026-07-09T09:24:24Z | |
| dc.date.issued | 2011 | |
| dc.description.abstract | A multi-layer PCB technology is used to implement an antenna-in-package solution for millimeter-wave-frequency applications. The antenna is a 1×2 array of dipoles fed by a vialess balun structure. The measurement and simulation results are compared for return loss and radiation pattern characteristics. | |
| dc.identifier.doi | 10.23919/eumc.2011.6101953 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/59773 | |
| dc.provenance.editstepuser | greet.vanhoof@imec.be | |
| dc.publisher | IEEE | |
| dc.source.beginpage | 1161 | |
| dc.source.conference | 41st European Microwave Conference | |
| dc.source.conferencedate | 2011-10-10 | |
| dc.source.conferencelocation | Manchester | |
| dc.source.endpage | 1164 | |
| dc.source.journal | 2011 41st European Microwave Conference | |
| dc.title | Antenna-in-package solution for millimeter-wave applications implemented in a microwave-compatible multilayer PCB technology | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| imec.internal.crawledAt | 2025-12-04 | |
| imec.internal.source | crawler | |
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