Publication:

Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective

Date

2007
Proceedings Paper
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dc.contributor.authorVandevelde, Bart
dc.contributor.authorBrebels, Steven
dc.contributor.authorOkoro, Chukwudi
dc.contributor.authorOprins, Herman
dc.contributor.authorChen, L.C.
dc.contributor.authorChristiaens, W.
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBrebels, Steven
dc.contributor.imecauthorOprins, Herman
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBrebels, Steven::0000-0002-1568-0286
dc.contributor.orcidimecOprins, Herman::0000-0003-0680-4969
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-16T21:06:30Z
dc.date.available2021-10-16T21:06:30Z
dc.date.issued2007
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/13129
dc.source.beginpage25
dc.source.conferenceProceedings 16th European Microelectronics and Packaging Conference - EMPC
dc.source.conferencedate17/06/2007
dc.source.conferencelocationOulu Finland
dc.source.endpage30
dc.title

Embedding of chips in flex: a global optimization from thermal, mechanical and electrical RF perspective

dc.typeProceedings paper
dspace.entity.typePublication
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