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Non-contact post Cu CMP cleaning using megasonic energy

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dc.contributor.authorFyen, Wim
dc.contributor.authorLauerhaas, Jeff
dc.contributor.authorVos, Rita
dc.contributor.authorMeuris, Marc
dc.contributor.authorMertens, Paul
dc.contributor.authorHeyns, Marc
dc.contributor.imecauthorVos, Rita
dc.contributor.imecauthorMeuris, Marc
dc.contributor.imecauthorMertens, Paul
dc.contributor.imecauthorHeyns, Marc
dc.contributor.orcidimecMeuris, Marc::0000-0002-9580-6810
dc.date.accessioned2021-10-14T16:57:12Z
dc.date.available2021-10-14T16:57:12Z
dc.date.embargo9999-12-31
dc.date.issued2001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/5304
dc.source.beginpage39
dc.source.conferenceUltra Clean Processing of Silicon Surfaces 2000: Proceedings of the 5th International Conference - UCPSS
dc.source.conferencedate18/09/2000
dc.source.conferencelocationOostende Belgium
dc.source.endpage42
dc.title

Non-contact post Cu CMP cleaning using megasonic energy

dc.typeProceedings paper
dspace.entity.typePublication
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