Publication:

Over-molding of flexible polyimide-based electronic circuits

Date

2021
Journal article
https://doi.org/10.1088/2058-8585/ac03bf
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dc.contributor.authorBakr, Mona
dc.contributor.authorSu, Yibo
dc.contributor.authorRezaei, Ali
dc.contributor.authorBossuyt, Frederick
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorBakr, Mona
dc.contributor.imecauthorBossuyt, Frederick
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecBakr, Mona::0000-0003-1623-6248
dc.contributor.orcidimecBossuyt, Frederick::0000-0003-3350-9295
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2022-02-23T10:11:33Z
dc.date.available2022-02-23T10:11:33Z
dc.date.issued2021
dc.identifier.doi10.1088/2058-8585/ac03bf
dc.identifier.issn2058-8585
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39046
dc.publisherIOP PUBLISHING LTD
dc.source.beginpage025007
dc.source.issue2
dc.source.journalFLEXIBLE AND PRINTED ELECTRONICS
dc.source.numberofpages12
dc.source.volume6
dc.title

Over-molding of flexible polyimide-based electronic circuits

dc.typeJournal article
dspace.entity.typePublication
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