Publication:

Contactless fault isolation of ultra low k dielectrics in soft breakdown condition

Date

2018
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorHerfurth, Norbert
dc.contributor.authorWu, Chen
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.authorCroes, Kristof
dc.contributor.authorBoit, Christian
dc.contributor.imecauthorWu, Chen
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.imecauthorCroes, Kristof
dc.contributor.orcidimecWu, Chen::0000-0002-4636-8842
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.date.accessioned2021-10-25T19:43:36Z
dc.date.available2021-10-25T19:43:36Z
dc.date.embargo9999-12-31
dc.date.issued2018
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/30876
dc.identifier.urlhttps://ieeexplore.ieee.org/document/8452487
dc.source.beginpage1
dc.source.conferenceInternational Symposium on the Physical and Failure Analysis of Integrated Circuits - IPFA
dc.source.conferencedate16/07/2018
dc.source.conferencelocationSingapore Singapore
dc.source.endpage5
dc.title

Contactless fault isolation of ultra low k dielectrics in soft breakdown condition

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
38359.pdf
Size:
3.06 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions