Publication:

Efficient Characterization of Interconnects With Arbitrary Polygonal Cross Sections Using Fokas-Derived Dirichlet-to-Neumann Operators

Date

2023
Journal article
https://doi.org/10.1109/TCPMT.2023.3303101
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dc.contributor.authorBosman, Dries
dc.contributor.authorHuynen, Martijn
dc.contributor.authorDe Zutter, Daniel
dc.contributor.authorSun, Xiao
dc.contributor.authorPantano, Nicolas
dc.contributor.authorvan der Plas, Geert
dc.contributor.authorBeyne, Eric
dc.contributor.authorGinste, Dries Vande
dc.contributor.authorVande Ginste, Dries
dc.contributor.imecauthorSun, Xiao
dc.contributor.imecauthorPantano, Nicolas
dc.contributor.imecauthorvan der Plas, Geert
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSun, Xiao::0000-0002-2468-8933
dc.contributor.orcidimecPantano, Nicolas::0000-0002-8803-8374
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2024-03-04T13:34:04Z
dc.date.available2023-12-02T16:54:11Z
dc.date.available2024-03-04T13:34:04Z
dc.date.issued2023
dc.identifier.doi10.1109/TCPMT.2023.3303101
dc.identifier.issn2156-3950
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/43210
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage1567
dc.source.endpage1575
dc.source.issue10
dc.source.journalIEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY
dc.source.numberofpages9
dc.source.volume13
dc.subject.keywordsSURFACE ADMITTANCE OPERATOR
dc.subject.keywordsTRANSMISSION-LINE PARAMETERS
dc.subject.keywordsELEMENT METHOD
dc.subject.keywordsCONDUCTORS
dc.subject.keywordsMATRIX
dc.title

Efficient Characterization of Interconnects With Arbitrary Polygonal Cross Sections Using Fokas-Derived Dirichlet-to-Neumann Operators

dc.typeJournal article
dspace.entity.typePublication
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