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High-energy proton-radiation tolerance in IGZO synaptic transistors

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0003-3523-327X
cris.virtualsource.departmentaf09d06d-8b75-4741-997d-a6feb1b0b52d
cris.virtualsource.orcidaf09d06d-8b75-4741-997d-a6feb1b0b52d
dc.contributor.authorPark, Woojin
dc.contributor.authorKwon, Ojun
dc.contributor.authorLee, Kyungmin
dc.contributor.authorOh, Seyoung
dc.contributor.authorYoo, Tae Jin
dc.contributor.authorLee, Yongsu
dc.contributor.authorKang, Chang Goo
dc.contributor.authorCho, Byungjin
dc.date.accessioned2026-06-08T09:25:08Z
dc.date.available2026-06-08T09:25:08Z
dc.date.createdwos2025-12-16
dc.date.issued2026
dc.description.abstractExposure to cosmic rays leads to partial degradation of the electronic devices. This study tested the resilience of bare indium-gallium-zinc-oxide synaptic transistors under 33 MeV high-energy proton irradiation. In the transistors tested, clear differences were observed before and after high-energy proton irradiation. The drive current was reduced by 10–30 %, showing degradation with high-energy radioactive irradiation in the drain-to-source current–gate-to-source voltage (IDS–VGS) transfer characteristics. Despite the structural damage, the transistor still exhibited reasonable switching behavior. To understand the effects of irradiation on the contact junction, the series resistance (RSD) was calculated; RSD increased from 361 to 546 kΩ. Potentiation and depression were measured for evaluating the performance of the neuromorphic device application. The plasticity synaptic current change (ΔPSC) was 37.7 and 22.8 nA before and after proton irradiation. When measuring the current values of the reservoir computing (RC) states, clear differences in states were observed post-proton irradiation.
dc.description.wosFundingTextInnovation Cluster Development Program (R&D) (P0025302) , supervised by the Korea Institute for Advancement of Technology (KIAT) . This work was supported by the National Research Foundation of Korea (NRF) grant funded by the Ministry of Science and ICT (MSIT) (No.RS-2025-02315930, Development of Core Technology for Rad-hard Materials, Devices and Characterization) . This research was supported by the Regional Innovation System & Education (RISE) program through the (Chungbuk Regional Innovation System & Education Center) , funded by the Ministry of Education (MOE) and the (Chungcheongbuk-do) , Republic of Korea. (2025-RISE-11-014-03) We would like to thank Editage ( www.editage.co.kr) for English language editing.
dc.identifier.doi10.1016/j.mssp.2025.110320
dc.identifier.issn1369-8001
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59618
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherELSEVIER SCI LTD
dc.source.beginpage110320
dc.source.journalMATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
dc.source.numberofpages7
dc.source.volume204
dc.title

High-energy proton-radiation tolerance in IGZO synaptic transistors

dc.typeJournal article
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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