Publication:

Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap

Date

2023
Journal article
https://doi.org/10.1109/JMW.2022.3223254
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dc.contributor.authorWagih, Mahmoud
dc.contributor.authorBalocchi, Leonardo
dc.contributor.authorBenassi, Francesca
dc.contributor.authorCarvalho, Nuno B.
dc.contributor.authorChiao, Jung-Chih
dc.contributor.authorCorreia, Ricardo
dc.contributor.authorCostanzo, Alessandra
dc.contributor.authorCui, Yepu
dc.contributor.authorGeorgiadou, Dimitra
dc.contributor.authorGouveia, Carolina
dc.contributor.authorGrosinger, Jasmin
dc.contributor.authorHo, John S.
dc.contributor.authorHu, Kexin
dc.contributor.authorKomolafe, Abiodun
dc.contributor.authorLemey, Sam
dc.contributor.authorLoss, Caroline
dc.contributor.authorMarrocco, Gaetano
dc.contributor.authorMitcheson, Paul
dc.contributor.authorPalazzi, Valentina
dc.contributor.authorPanunzio, Nicoletta
dc.contributor.imecauthorLemey, Sam
dc.contributor.imecauthorRogier, Hendrik
dc.contributor.imecauthorVan Torre, Patrick
dc.contributor.orcidimecLemey, Sam::0000-0003-1366-2604
dc.contributor.orcidimecRogier, Hendrik::0000-0001-8139-2736
dc.contributor.orcidimecVan Torre, Patrick::0000-0002-0633-0815
dc.date.accessioned2023-11-06T09:00:44Z
dc.date.available2023-10-23T10:15:04Z
dc.date.available2023-11-06T09:00:44Z
dc.date.embargo2023-01-06
dc.date.issued2023
dc.description.wosFundingTextThis work was supported in part by the U.K. Royal Academy of Engineering (RAEng) and the Office of the Chief Science Adviser for National Security through the U.K. Intelligence Community Research Fellowship Programme, in part by the RAEng chairs in emerging technologies scheme, in part by the U.K. Engineering and Physical Sciences Research Council, under Grant EP/P010164/1, and in part by UKRI under Grant MR/V024442/1.
dc.identifier.doi10.1109/JMW.2022.3223254
dc.identifier.issn2692-8388
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/42906
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage193
dc.source.endpage226
dc.source.issue1
dc.source.journalIEEE JOURNAL OF MICROWAVES
dc.source.numberofpages34
dc.source.volume3
dc.subject.keywordsWIRELESS POWER TRANSFER
dc.subject.keywordsSPLIT-RING-RESONATOR
dc.subject.keywordsCOPLANAR WAVE-GUIDE
dc.subject.keywordsTEXTILE ANTENNA
dc.subject.keywordsRFID-TAG
dc.subject.keywordsON-BODY
dc.subject.keywordsHARMONIC TRANSPONDER
dc.subject.keywordsLOW-PROFILE
dc.subject.keywordsFULL-DUPLEX
dc.subject.keywordsFDD RADIO
dc.title

Microwave-Enabled Wearables: Underpinning Technologies, Integration Platforms, and Next-Generation Roadmap

dc.typeJournal article
dspace.entity.typePublication
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