Publication:

Electrical characterization, modeling and reliability analysis of a via last TSV

Date

2010
Proceedings Paper
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dc.contributor.authorMajeed, Bivragh
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorVandevelde, Bart
dc.contributor.authorDuval, Fabrice
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorMajeed, Bivragh
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorDuval, Fabrice
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-18T18:39:53Z
dc.date.available2021-10-18T18:39:53Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/17555
dc.source.beginpage124
dc.source.conference12th Electronics Packaging Technology Conference - EPTC
dc.source.conferencedate8/12/2010
dc.source.conferencelocationSingapore Singapore
dc.source.endpage128
dc.title

Electrical characterization, modeling and reliability analysis of a via last TSV

dc.typeProceedings paper
dspace.entity.typePublication
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