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Modeling and experimental verification of substrate coupling and isolation techniques in mixed-signal ICs on a lightly-doped substrate

Date

2005-06
Proceedings Paper
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dc.contributor.authorVan der Plas, Geert
dc.contributor.authorSoens, Charlotte
dc.contributor.authorBadaroglu, Mustafa
dc.contributor.authorWambacq, Piet
dc.contributor.authorDonnay, Stephane
dc.contributor.imecauthorVan der Plas, Geert
dc.contributor.imecauthorSoens, Charlotte
dc.contributor.imecauthorBadaroglu, Mustafa
dc.contributor.imecauthorWambacq, Piet
dc.contributor.imecauthorDonnay, Stephane
dc.contributor.orcidimecVan der Plas, Geert::0000-0002-4975-6672
dc.contributor.orcidimecWambacq, Piet::0000-0003-4388-7257
dc.contributor.orcidimecDonnay, Stephane::0000-0003-2489-4793
dc.date.accessioned2021-10-16T06:04:24Z
dc.date.available2021-10-16T06:04:24Z
dc.date.issued2005-06
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/11381
dc.source.beginpage280
dc.source.conferenceTechnical Digest Symposium on VLSI Circuits: Digest of Technical Papers
dc.source.conferencedate16/06/2005
dc.source.conferencelocationKyoto Japan
dc.source.endpage283
dc.title

Modeling and experimental verification of substrate coupling and isolation techniques in mixed-signal ICs on a lightly-doped substrate

dc.typeProceedings paper
dspace.entity.typePublication
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