Publication:

Copper-SiLK* semiconductor dielectric interface: XPS surface analysis and RF plasma treatment of the resin

Date

1999
Meeting abstract
Simple item page Full metadata Statistics
 
dc.contributor.authorLemaire, J. J.
dc.contributor.authorRajagopal, A.
dc.contributor.authorGregoire, C.
dc.contributor.authorPireaux, J. J.
dc.contributor.authorBaklanov, Mikhaïl
dc.contributor.authorVanhaelemeersch, Serge
dc.contributor.authorMaex, Karen
dc.contributor.authorWaeterloos, Joost
dc.contributor.imecauthorVanhaelemeersch, Serge
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecVanhaelemeersch, Serge::0000-0003-2102-7395
dc.date.accessioned2021-10-14T11:29:33Z
dc.date.available2021-10-14T11:29:33Z
dc.date.embargo9999-12-31
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3614
dc.source.beginpage738
dc.source.conference196th Meeting of the Electrochemical Society: Interconnects and Contact Metallization for ULSI
dc.source.conferencedate17/10/1999
dc.source.conferencelocationHonolulu, HI USA
dc.title

Copper-SiLK* semiconductor dielectric interface: XPS surface analysis and RF plasma treatment of the resin

dc.typeMeeting abstract
dspace.entity.typePublication
Files

Original bundle

Name:
3580.pdf
Size:
359.7 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions