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Insertion bonding: A novel Cu-Cu bonding approach for 3D integration
Publication:
Insertion bonding: A novel Cu-Cu bonding approach for 3D integration
Date
2010
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Okoro, Chukwudi
;
Agarwal, Rahul
;
Limaye, Paresh
;
Vandevelde, Bart
;
Vandepitte, Dirk
;
Beyne, Eric
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1875
since deposited on 2021-10-18
406
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations
Metrics
Views
1875
since deposited on 2021-10-18
406
item.page.metrics.field.last-week
Acq. date: 2025-10-24
Citations