Publication:

End-fire antenna-in-package solution for millimeter-wave applications in a Teflon-based PCB technology

Date

2013
Proceedings Paper
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dc.contributor.authorEnayati, Amin
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorOcket, Ilja
dc.contributor.authorVandenbosch, Guy
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorOcket, Ilja
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.date.accessioned2021-10-21T07:28:51Z
dc.date.available2021-10-21T07:28:51Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22308
dc.identifier.urlhttp://ieeexplore.ieee.org/document/6686587/
dc.source.beginpage48
dc.source.conferenceEuropean Microwavae Conference - EuMC
dc.source.conferencedate6/10/2013
dc.source.conferencelocationNuremberg Germany
dc.source.endpage51
dc.title

End-fire antenna-in-package solution for millimeter-wave applications in a Teflon-based PCB technology

dc.typeProceedings paper
dspace.entity.typePublication
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