Publication:

Multiscale Thermal Impact of BSPDN: SoC Hotspot Challenges and Partial Mitigation

Date

2024
Proceedings Paper
https://doi.org/10.1109/iedm50854.2024.10873567
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dc.contributor.authorVermeersch, Bjorn
dc.contributor.authorMishra, Subrat
dc.contributor.authorBrunion, Moritz
dc.contributor.authorZografos, Odysseas
dc.contributor.authorLofrano, Melina
dc.contributor.authorOprins, Herman
dc.contributor.authorMyers, James
dc.contributor.authorTokei, Zsolt
dc.contributor.authorHellings, Geert
dc.date.accessioned2026-04-22T07:21:54Z
dc.date.available2026-04-22T07:21:54Z
dc.date.createdwos2026-03-18
dc.date.issued2024
dc.description.abstractRealistic workload-based CPU powermaps reveal that nonuniform dissipation majorly accentuates hotspots in BSPDN based designs. 1 μm -resolution temperature simulations of an 80-core server SoC show ~ 14°C penalties relative to FSPDN caused by interplay of extraneous thermal resis-tance (BEOL + wafer bonding) and BSPDN heat spreading. Mitigation strategies are proposed and quantified.
dc.identifier.doi10.1109/iedm50854.2024.10873567
dc.identifier.issn2380-9248
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/59150
dc.language.isoeng
dc.provenance.editstepusergreet.vanhoof@imec.be
dc.publisherIEEE
dc.source.conferenceIEEE International Electron Devices Meeting (IEDM)
dc.source.conferencedate2024-12-07
dc.source.conferencelocationSan Francisco
dc.source.journal2024 IEEE International Electron Devices Meeting, IEDM
dc.source.numberofpages4
dc.title

Multiscale Thermal Impact of BSPDN: SoC Hotspot Challenges and Partial Mitigation

dc.typeProceedings paper
dspace.entity.typePublication
imec.internal.crawledAt2026-04-07
imec.internal.sourcecrawler
imec.internal.wosCreatedAt2026-04-07
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