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Articles
Effect of 4-point bending test procedure on crack propagation in thin film stacks
Publication:
Effect of 4-point bending test procedure on crack propagation in thin film stacks
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Date
2015
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Kljucar, Luka
;
Gonzalez, Mario
;
Vanstreels, Kris
;
Ivankovic, Andrej
;
Hecker, Michael
;
De Wolf, Ingrid
Journal
Microelectronic Engineering
Abstract
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1973
since deposited on 2021-10-22
1
last month
Acq. date: 2025-12-11
Citations
Metrics
Views
1973
since deposited on 2021-10-22
1
last month
Acq. date: 2025-12-11
Citations